16-Piece Universal BGA Direct Heat Stencil Set – SMT SMD Rework BGA Rework Stencil SWANS As Shown NONE

16-Piece Universal BGA Direct Heat Stencil Set – SMT SMD Rework

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Sale price  $27.90 Regular price  $37.84
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16-Piece Universal BGA Direct Heat Stencil Set – SMT SMD Rework BGA Rework Stencil SWANS As Shown NONE

16-Piece Universal BGA Direct Heat Stencil Set – SMT SMD Rework

Sale price  $27.90 Regular price  $37.84
ColorAs Shown
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16-Piece Universal BGA Direct Heat Stencil Kit – SMT/SMD Chip Rework

Upgrade your soldering and chip rework station with this comprehensive 16-piece Universal BGA Direct Heat Stencil Set. Precision-cut from imported stainless steel, these stencils are engineered to handle a wide range of BGA chip sizes found on laptops, desktops, graphics cards, and communication motherboards — making them an essential addition to any electronics repair toolkit.

Key Features

  • Premium Stainless Steel Construction: Made from imported stainless steel plate with optimal mesh thickness, ensuring durability and resistance to heat deformation when used with a hot air gun.
  • Direct Heat Compatible: Designed for direct heating with an air gun — the steel mesh maintains its shape even under sustained heat, providing consistent, reliable results.
  • 16-Piece Comprehensive Set: Covers virtually all common BGA chip footprints in current use, from fine-pitch 0.3mm to standard 0.76mm ball sizes.
  • Minimized Solder Ball Waste: Each stencil's aperture area is precisely matched to its corresponding BGA chip area, reducing waste of solder balls during reballing.
  • Wide Compatibility: Suitable for notebook motherboards, desktop motherboards, northbridge/southbridge chips, graphics cards, and other BGA-type communication circuit boards.

Complete Stencil Size Breakdown (16 pcs)

  • 1× 0.3mm universal stencil (P=0.58mm)
  • 1× 0.35mm universal stencil (P=0.6mm)
  • 1× 0.4mm universal stencil (P=0.7mm)
  • 1× 0.45mm universal stencil (P=0.78mm)
  • 1× 0.5mm universal stencil (P=0.78mm)
  • 2× 0.6mm universal stencil (P=0.9mm, P=1.1mm)
  • 1× 0.5mm universal stencil (P=0.8mm) – 40mm × 40mm
  • 4× 0.6mm universal stencil (P=0.99mm) – 24×24mm, 27×27mm, 30×30mm, 41×41mm
  • 4× 0.76mm universal stencil (P=1.27mm) – 30×30mm, 33×33mm, 34×34mm, 41×41mm

Package Contents

  • 16× BGA stencil steel meshes
  • 1× Clamp
  • 1× Wrench

Made in Mainland China.

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Frequently Asked Questions

Q: What types of chips are compatible with this universal BGA stencil set?

A: This 16-piece BGA direct heat stencil set covers a wide range of common BGA chips used in laptop motherboards, desktop motherboards, graphics cards, northbridge/southbridge chips, and communication circuit boards. The set includes stencils with ball pitches ranging from 0.58mm to 1.27mm, covering the majority of chips encountered in typical electronics repair work.

Q: Can these BGA stencils be used directly with a hot air gun?

A: Yes. These stencils are specifically designed for direct heat application using a hot air gun (reballing station or heat gun). The imported stainless steel construction ensures the mesh is heat-resistant and will not easily warp or deform under the temperatures used in standard BGA chip rework and reballing procedures.

Q: How do I choose the correct stencil from the 16-piece set for my BGA chip?

A: Match the stencil pitch (P= value) and size (mm × mm) to your specific BGA chip's ball pitch and package dimensions. The stencil aperture area is designed to closely match the chip's BGA footprint to minimize solder ball waste. For chips with non-uniform ball alignment or non-standard pitches, a specialized stencil may be required in addition to this universal set.

Production & Packaging Notice

To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.

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